SELF BONDING ENAMELLED ROUND COPPER WIRE (SBUEW)
Heat Resistance Grades:
130°C (B Class), 155°C (F Class), 180°C (H Class), 200°C (C Class)
Diameter Range:
0.010mm - 6.00mm
Implementation Standards:
GB6109.5
GB4074
Reference Standards:
NEMA MW1000-1997
IEC-60317
JIS-3202
Performance Features:
Self bonding wire has an additional adhesive enamel overcoated which has a bonding feature that
is activated by heats or solvents. Once activated, the adhesive bonds turn to turn winding into
a compact self supporting coil.
Application:
Alcohol, hot air, resistance bonding, thermosetting bonding methods are suitable. It is applied
in self supporting coils, watches coil micro motors, voice coil, electrical toys, smart card
coils, relays and valves etc.